Invention Grant
- Patent Title: Loop heat pipe
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Application No.: US16263032Application Date: 2019-01-31
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Publication No.: US11060798B2Publication Date: 2021-07-13
- Inventor: Yoshihiro Machida
- Applicant: Shinko Electric Industries Co., LTD.
- Applicant Address: JP Nagano-Ken
- Assignee: Shinko Electric Industries Co., LTD.
- Current Assignee: Shinko Electric Industries Co., LTD.
- Current Assignee Address: JP Nagano-Ken
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JPJP2018-019487 20180206
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28D15/02

Abstract:
A loop heat pipe includes an evaporator, a condenser, a liquid pipe, and a vapor pipe. The liquid pipe is formed a metal layer stack of metal layers. The metal layers include a first metal layer through which a first through hole extends in a thickness-wise direction. The liquid pipe includes a flow passage formed by at least the first through hole and having four walls that define the flow passage. The liquid pipe further includes a plurality of porous bodies that form at least two of the four walls of the flow passage.
Public/Granted literature
- US20190242654A1 LOOP HEAT PIPE Public/Granted day:2019-08-08
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