Invention Grant
- Patent Title: Thermal interface material system
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Application No.: US14967087Application Date: 2015-12-11
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Publication No.: US11060805B2Publication Date: 2021-07-13
- Inventor: Tadej Semenic , Kyle D. Gould , Avijit Bhunia
- Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLC.
- Applicant Address: US CA Thousand Oaks
- Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC.
- Current Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC.
- Current Assignee Address: US CA Thousand Oaks
- Agency: K&L Gates LLP
- Main IPC: H01L23/373
- IPC: H01L23/373 ; F28F21/08 ; F28F13/00 ; H01L23/42 ; F28F21/02
Abstract:
A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.
Public/Granted literature
- US20160169598A1 Thermal Interface Material System Public/Granted day:2016-06-16
Information query
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