Invention Grant
- Patent Title: Sensor assemblies; sensor-enabled garments and objects; devices and systems for data collection
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Application No.: US16095268Application Date: 2017-04-21
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Publication No.: US11060926B2Publication Date: 2021-07-13
- Inventor: Roberto Reif , Maria Pia Carmagnani , Warren Kline , Dave Svab , Maurizio Macagno , Chris Small , Blake Coudriet , Matthew Kueper
- Applicant: Sensoria, Inc.
- Applicant Address: US WA Redmond
- Assignee: Sensoria, Inc.
- Current Assignee: Sensoria, Inc.
- Current Assignee Address: US WA Redmond
- International Application: PCT/US2017/028976 WO 20170421
- International Announcement: WO2017/185050 WO 20171026
- Main IPC: G01L1/00
- IPC: G01L1/00 ; G01L1/18 ; A61B5/11 ; A43B17/00 ; A61B5/00 ; A61B5/103 ; A43B3/00 ; G01L1/20 ; G16H40/63 ; G16H50/20 ; A43D1/02 ; G16H50/30 ; A61B5/024 ; A61B5/01 ; G16H20/30

Abstract:
Components and assemblies for acquisition and analysis of data collected from sites such body surfaces, footwear and apparel, objects, accessories, and the like are directed to providing intermittent and/or continuous monitoring and reporting of conditions such as force, pressure, shear and other conditions, activity and/or environmental parameters at body locations and/or at an interface of a body location and an object. In one aspect, sensor assemblies comprise one or more sensor(s) and/or associated electronics associated with at least one non-conductive carrier layer. Electronic components including sensor acquisition systems (SAS) and dedicated electronics devices (DED) providing electronics components for signal conditioning, data collection, storage, analysis, feedback, communications and optional sensing capabilities are also described.
Public/Granted literature
- US20190094088A1 SENSOR ASSEMBLIES; SENSOR-ENABLED GARMENTS AND OBJECTS; DEVICES AND SYSTEMS FOR DATA COLLECTION Public/Granted day:2019-03-28
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