Invention Grant
- Patent Title: Wafer inspection system, wafer inspection apparatus and prober
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Application No.: US17007203Application Date: 2020-08-31
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Publication No.: US11061071B2Publication Date: 2021-07-13
- Inventor: Junichi Hagihara , Shigekazu Komatsu , Kunihiro Furuya , Tadayoshi Hosaka , Naoki Muramatsu
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2013-224460 20131029
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/04 ; H01L21/677 ; H01L21/687
Abstract:
A wafer inspection system is provided. The wafer inspection system includes: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.
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