Invention Grant
- Patent Title: Apparatus to control transfer parameters during transfer of semiconductor devices
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Application No.: US16146833Application Date: 2018-09-28
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Publication No.: US11062923B2Publication Date: 2021-07-13
- Inventor: Justin Wendt , Cody Peterson , Andrew Huska
- Applicant: Rohinni, LLC
- Applicant Address: US ID Coeur d'Alene
- Assignee: Rohinni, LLC
- Current Assignee: Rohinni, LLC
- Current Assignee Address: US ID Coeur d'Alene
- Agency: Lee & Hayes, P.C.
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H01L21/67 ; H01L21/683 ; H01L21/677 ; H01L23/00 ; H01L33/48
Abstract:
An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.
Information query
