Leadframes, integrated circuit packaging with wettable flanks, and methods of manufacturing the same are disclosed. An example packaged device having a leadframe includes a die pad and a lead spaced apart from the die pad. The lead has a proximal end adjacent the die pad and a distal end extending away from the die pad. The lead has a thickness at the distal end that is less than a full thickness of the leadframe between a first outer surface on a die attach side of the leadframe and a second outer surface on a mounting side of the leadframe.