Invention Grant
- Patent Title: Light emitting diode and fabrication method thereof
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Application No.: US16137525Application Date: 2018-09-20
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Publication No.: US11063184B2Publication Date: 2021-07-13
- Inventor: Chao Jin , Chuang Yu Hsieh , Chen Kang Hsieh , Duxiang Wang , Chaoyu Wu , Chih Pang Ma
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201610267719.0 20160427
- Main IPC: H01L33/38
- IPC: H01L33/38 ; C23C28/00 ; C23C18/16 ; C23C14/58 ; C23C14/14 ; C23C14/24 ; C23C18/31 ; C23C28/02 ; H01L25/075 ; H01L33/06 ; H01L33/12 ; H01L33/14 ; H01L33/30 ; H01L33/32 ; H01L33/44 ; H01L33/62

Abstract:
A light-emitting diode includes: a light emitting epitaxial structure including a first-type semiconductor layer, an active layer and a second-type semiconductor layer, and having a first surface as a light emitting surface, and an opposing second surface; a conducting layer formed over the second surface and including a physical plating layer and a chemical plating layer, wherein the physical plating layer is adjacent to the light emitting epitaxial structure and has cracks, and the chemical plating layer fills the cracks in the physical plating layer; and a submount coupled to the light emitting epitaxial laminated layer through the conducting layer.
Public/Granted literature
- US20190027652A1 Light Emitting Diode and Fabrication Method Thereof Public/Granted day:2019-01-24
Information query
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