Invention Grant
- Patent Title: Solar module
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Application No.: US15790669Application Date: 2017-10-23
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Publication No.: US11063552B2Publication Date: 2021-07-13
- Inventor: Ting-Hui Huang
- Applicant: HELIARTEC SOLUTIONS CORPORATION, LTD.
- Applicant Address: TW Hsinchu County
- Assignee: HELIARTEC SOLUTIONS CORPORATION, LTD.
- Current Assignee: HELIARTEC SOLUTIONS CORPORATION, LTD.
- Current Assignee Address: TW Hsinchu County
- Agency: Behmke Innovation Group LLC
- Agent James M. Behmke; Jonathon P. Western
- Priority: TW106124903 20170725
- Main IPC: H02S20/26
- IPC: H02S20/26 ; H01L31/048 ; H02S40/20 ; H01L31/0216

Abstract:
The present disclosure provides a solar module including an encapsulation layer, a plurality of solar cells embedded in the encapsulation layer with gaps between the solar cells; and a first patterned layer formed on the encapsulation layer and corresponding to locations of the gaps so as to absorb the light penetrating through the gaps, thereby shielding buildings from sunlight and thus saving energy.
Public/Granted literature
- US20190036475A1 SOLAR MODULE Public/Granted day:2019-01-31
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