Invention Grant
- Patent Title: Laser processing apparatus
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Application No.: US16157639Application Date: 2018-10-11
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Publication No.: US11065717B2Publication Date: 2021-07-20
- Inventor: Yuji Hadano , Masatoshi Nayuki , Keiji Nomaru
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JPJP2017-201208 20171017
- Main IPC: B23K26/142
- IPC: B23K26/142 ; B23K26/06 ; H01L21/67 ; B23K26/53 ; B23K26/146

Abstract:
A laser beam applying unit of a laser processing apparatus includes a laser oscillator, a condenser adapted to focus the laser beam emitted from the laser oscillator and apply the laser beam to a workpiece, and a liquid jetting apparatus disposed at a lower end portion of the condenser and adapted to jet a liquid to an upper surface of the workpiece. The liquid jetting apparatus includes: a transparent plate disposed at the lower end portion of the condenser and permitting transmission therethrough of the laser beam; a casing provided with a space defined by a ceiling wall composed of the transparent plate, side walls, and a bottom wall; an opening formed in the bottom plate, extending in a processing feeding direction, and permitting passage therethrough of the laser beam focused by the condenser; and a liquid supply section adapted to supply the liquid to the casing.
Public/Granted literature
- US20190111518A1 LASER PROCESSING APPARATUS Public/Granted day:2019-04-18
Information query
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