Invention Grant
- Patent Title: Method for cleaving amide bonds
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Application No.: US16066967Application Date: 2016-12-28
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Publication No.: US11066526B2Publication Date: 2021-07-20
- Inventor: Laura Jing Jing , Craig Steven Harris
- Applicant: GALDERMA HOLDING S.A.
- Applicant Address: CH La Tour-de-Peilz
- Assignee: GALDERMA HOLDING S.A.
- Current Assignee: GALDERMA HOLDING S.A.
- Current Assignee Address: CH La Tour-de-Peilz
- Agency: Foley & Lardner LLP
- Agent Sunit Talapatra
- Priority: EP15202944 20151229,EP16172225 20160531,EP16172241 20160531,EP16172254 20160531
- International Application: PCT/EP2016/082770 WO 20161228
- International Announcement: WO2017/114859 WO 20170706
- Main IPC: C07C209/62
- IPC: C07C209/62 ; C08J3/075 ; C08B37/00 ; C08B37/08 ; C08L5/00 ; C08J3/24 ; C08L5/08 ; C07C213/00 ; C07C269/06 ; C07F7/08 ; C08J7/14 ; C08K5/09 ; A61K8/04 ; A61K8/73 ; A61Q19/00 ; A61K9/00
Abstract:
A method for cleaving amide bonds, comprising: a) providing a molecule comprising an amide group; b) reacting the molecule comprising an amide group with hydroxylamine (NH2OH) or a salt thereof to cleave the amide bond of the amide group.
Public/Granted literature
- US20190010113A1 METHOD FOR CLEAVING AMIDE BONDS Public/Granted day:2019-01-10
Information query
