A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.