Provided is a solvent borne deicing composition which includes in a solvent, a blend of an inorganic salt, a low molecular weight lignin in an amount of at least 5 weight % (or 10 or 15 or 20 weight %) to 30 or 40 or 50 weight % of the solids, and hemicellulose in an amount of at least 0.1 weight % (or 0.2 or 0.5 or 1.0 or 2.0 or 5.0 weight %) to 20 weight % (or 10 or 15 or 18 or 25 or 30 weight %) of the solids.