Invention Grant
- Patent Title: HEMT wafer probe current collapse screening
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Application No.: US16400336Application Date: 2019-05-01
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Publication No.: US11067620B2Publication Date: 2021-07-20
- Inventor: Dong Seup Lee , Jungwoo Joh , Pinghai Hao , Sameer Pendharkar
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R27/26

Abstract:
A method includes applying a DC stress condition to a transistor for a predetermined stress time, measuring an impedance of the transistor after the predetermined stress time, and repeating the application of the DC stress condition and the measurement of the impedance until the measured impedance exceeds an impedance threshold or a total stress time exceeds a time threshold, where the DC stress condition includes applying a non-zero drain voltage signal to a drain terminal of the transistor, applying a gate voltage signal to a gate terminal of the transistor, and applying a non-zero source current signal to a source terminal of the transistor.
Public/Granted literature
- US20200064394A1 HEMT WAFER PROBE CURRENT COLLAPSE SCREENING Public/Granted day:2020-02-27
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