Invention Grant
- Patent Title: Coil pattern, method for forming same, and chip device including same
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Application No.: US16077439Application Date: 2017-03-13
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Publication No.: US11069472B2Publication Date: 2021-07-20
- Inventor: In Kil Park , Seung Hun Cho , Gyeong Tae Kim , Jun Ho Jung , Sang Jun Park
- Applicant: MODA-INNOCHIPS CO., LTD.
- Applicant Address: KR Ansan-Si
- Assignee: MODA-INNOCHIPS CO., LTD.
- Current Assignee: MODA-INNOCHIPS CO., LTD.
- Current Assignee Address: KR Ansan-Si
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2016-0039653 20160331
- International Application: PCT/KR2017/002666 WO 20170313
- International Announcement: WO2017/171265 WO 20171005
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F17/00 ; H01F41/04 ; H01F17/04 ; C25D3/38 ; C25D5/02 ; C25D5/10 ; C25D7/00 ; H05K1/16 ; H05K3/24
Abstract:
Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating.
Public/Granted literature
- US20190051446A1 COIL PATTERN, METHOD FOR FORMING SAME, AND CHIP DEVICE INCLUDING SAME Public/Granted day:2019-02-14
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