Invention Grant
- Patent Title: Multilayer ceramic electronic component and board for mounting of the same
-
Application No.: US16669911Application Date: 2019-10-31
-
Publication No.: US11069481B2Publication Date: 2021-07-20
- Inventor: Hye Min Bang , Bum Su Kim , Hyun Hee Gu , Hee Sang Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0069956 20180619
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/012 ; H01G4/232 ; H01G4/248 ; H01G4/30 ; H05K1/18 ; H01G4/12 ; H05K1/11

Abstract:
A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
Public/Granted literature
- US20200066451A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING OF THE SAME Public/Granted day:2020-02-27
Information query