Invention Grant
- Patent Title: Method for delidding a hermetically sealed circuit package
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Application No.: US16657593Application Date: 2019-10-18
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Publication No.: US11069537B2Publication Date: 2021-07-20
- Inventor: Ali Hadjikhani , Michael R. Parent
- Applicant: HAMILTON SUNDSTRAND CORPORATION
- Applicant Address: US NC Charlotte
- Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee Address: US NC Charlotte
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; B23K26/38 ; B23K26/0622
Abstract:
A method of delidding an integrated circuit (IC) package includes directing a laser beam along a cut line of an integrated circuit package. The cut line defines a removable portion, the cutting occurs along the cut line, and the removable portion is removed after the directing. A method of troubleshooting an integrated circuit package is also disclosed.
Public/Granted literature
- US20210118695A1 METHOD FOR DELIDDING A HERMETICALLY SEALED CIRCUIT PACKAGE Public/Granted day:2021-04-22
Information query
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