Invention Grant
- Patent Title: Measurement system, substrate processing system, and device manufacturing method
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Application No.: US16868952Application Date: 2020-05-07
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Publication No.: US11069552B2Publication Date: 2021-07-20
- Inventor: Go Ichinose , Tomonori Dosho
- Applicant: NIKON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: NIKON CORPORATION
- Current Assignee: NIKON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2016-192810 20160930
- Main IPC: H01L21/68
- IPC: H01L21/68 ; G03F7/26 ; G01B11/27 ; G03F1/42 ; G03F7/20 ; G03F9/00 ; G01B21/00

Abstract:
A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.
Public/Granted literature
- US11107718B2 Measurement system, substrate processing system, and device manufacturing method Public/Granted day:2021-08-31
Information query
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