Semiconductor manufacturing equipment includes a thickness calculation function, the thickness calculation function including a measurement value acquisition unit configured to acquire a plurality of measurement values at different measurement positions of the wafer from a thickness measurement function configured to measure a thickness of the wafer, a histogram data creation unit configured to create histogram data based on the plurality of measurement values, and a grade group extraction unit configured to extract a grade group from the histogram data, the grade group including sequential grades having frequencies equal to or greater than a predetermined frequency, the thickness calculation function further including a representative value calculation unit configured to calculate a representative value of a thickness of a measurement region based on the grades included in the extracted grade group.