Invention Grant
- Patent Title: Solid-state imaging apparatus, method for manufacturing the same, and electronic device
-
Application No.: US16326806Application Date: 2017-08-31
-
Publication No.: US11069730B2Publication Date: 2021-07-20
- Inventor: Sintaro Nakajiki , Yukihiro Sayama
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P C.
- Priority: JPJP2016-171862 20160902,JPJP2017-160855 20170824
- International Application: PCT/JP2017/031394 WO 20170831
- International Announcement: WO2018/043654 WO 20180308
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N9/07 ; G02B5/20 ; G02B5/22 ; H04N5/374

Abstract:
The present technology relates to a solid-state imaging apparatus capable of suppressing occurrence of color mixing, a method for manufacturing the solid-state imaging apparatus, and an electronic device. The solid-state imaging apparatus includes a plurality of pixels arranged in a pixel region. Each of the pixels has: a first optical filter layer disposed on a photoelectric conversion unit; a second optical filter layer disposed on the first optical filter layer; and a separation wall separating at least a part of the first optical filter layer for each of the pixels. Either the first optical filter layer or the second optical filter layer in at least one of the pixels is formed by an infrared cut filter, while the other is formed by a color filter. The present technology can be applied to a CMOS image sensor including a visible light pixel.
Public/Granted literature
- US20190206917A1 SOLID-STATE IMAGING APPARATUS, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE Public/Granted day:2019-07-04
Information query
IPC分类: