Invention Grant
- Patent Title: Optical component package and device using same
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Application No.: US16738827Application Date: 2020-01-09
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Publication No.: US11069839B2Publication Date: 2021-07-20
- Inventor: Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
- Applicant: POINT ENGINEERING CO., LTD.
- Applicant Address: KR Asan
- Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee: POINT ENGINEERING CO., LTD.
- Current Assignee Address: KR Asan
- Priority: KR10-2019-0056518 20190514
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/58 ; H01L33/62 ; H01L33/64

Abstract:
Disclosed is an optical component package. The optical component package according to the present invention includes: a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a sub-substrate provided in a cavity of the main substrate, and electrically connected to each of the metal bodies with the vertical insulation part interposed therebetween; an optical component mounted on the sub-substrate; and a light transmitting member provided above the optical component, wherein the sub-substrate includes: an insulating body; a via hole vertically passing through the insulating body, and filled with a metal material; and a metal pad connected to the optical component.
Information query
IPC分类: