Invention Grant
- Patent Title: Connector formation structure, electronic control apparatus and production method for connector formation structure
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Application No.: US16626606Application Date: 2018-05-24
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Publication No.: US11070001B2Publication Date: 2021-07-20
- Inventor: Yusuke Kitai , Katsuhide Oohashi , Ko Sasaki , Takayuki Hagiya , Takuya Igarashi , Michimori Watanabe
- Applicant: Hitachi Automotive Systems, Ltd.
- Applicant Address: JP Hitachinaka
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka
- Agency: Crowell & Moring LLP
- Priority: JPJP2017-133841 20170707
- International Application: PCT/JP2018/019945 WO 20180524
- International Announcement: WO2019/008933 WO 20190110
- Main IPC: H01R13/405
- IPC: H01R13/405 ; H01R13/504 ; F02D9/10 ; H01R13/66 ; H01R43/24 ; H02K5/10 ; H02K5/22 ; H02K7/116

Abstract:
Airtightness of a connector molding is improved. There is provided a connector molding in which a conductor and a fixing member are integrally molded with a molded body including a connector portion. The conductor is fixed to the fixing member, and is integrally molded with the molded body in a state in which an external connection end portion protrudes into a space within the connector portion. A part of the fixing member is exposed to the space within the connector portion and the remaining portion is covered by the molded body, or the entire fixing member is covered by the molded body.
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