Invention Grant
- Patent Title: Subslot bundling and acknowledgement
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Application No.: US16821913Application Date: 2020-03-17
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Publication No.: US11071121B2Publication Date: 2021-07-20
- Inventor: Chong Li , Junyi Li , Hao Xu , Jing Jiang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox LLP
- Main IPC: H04W72/08
- IPC: H04W72/08 ; H04W52/14 ; H04L1/16 ; H04W52/24 ; H04L5/00 ; H04W72/04 ; H04L1/00 ; H04L1/18

Abstract:
A first apparatus may puncture, in at least two subslots, a first type of data or control information with a second type of data or control information. The first apparatus may bundle the least two subslots within a subframe, and the subframe may include a portion for carrying acknowledgment (ACK)/negative acknowledgment (NACK) information associated with the second type of data or control information. The first apparatus may communicate with a user equipment (UE) during the at least two subslots within the subframe. A second apparatus may receive ACK/NACK information associated with a second type of data or control information. The second apparatus may reduce a transmission power for a first type of data or control information during a subsequent subframe when the ACK/NACK information indicates a negative acknowledgement.
Public/Granted literature
- US20200322961A1 SUBSLOT BUNDLING AND ACKNOWLEDGEMENT Public/Granted day:2020-10-08
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