Invention Grant
- Patent Title: Semiconductor device manufacturing method
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Application No.: US16728547Application Date: 2019-12-27
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Publication No.: US11071212B2Publication Date: 2021-07-20
- Inventor: Bin Wan Mat Wan Azha , Takeshi Yokoyama
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2019-027207 20190219
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K3/34 ; H01L23/498 ; H01L25/07 ; H05K3/30 ; H05K3/40 ; H01L23/00 ; B23K3/04

Abstract:
A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.
Public/Granted literature
- US20200267845A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2020-08-20
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