Invention Grant
- Patent Title: Semiconductor chuck and method of making
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Application No.: US16552856Application Date: 2019-08-27
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Publication No.: US11075104B2Publication Date: 2021-07-27
- Inventor: Fu-Zen Lin , Chien-Hsiang Chen , Chih-Shen Yang , Hsu-Shui Liu , Cheng-Yi Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/683
Abstract:
A semiconductor chuck is provided. The semiconductor chuck includes a metal base and a first adhesive layer over the metal base. The semiconductor chuck includes a dielectric layer over the first adhesive layer, wherein the dielectric layer is adhered to the metal base by the first adhesive layer. The semiconductor chuck includes a removable protective plate over the dielectric layer, wherein a first portion of the removable protective plate covers a top surface of the dielectric layer.
Public/Granted literature
- US20210066108A1 SEMICONDUCTOR CHUCK AND METHOD OF MAKING Public/Granted day:2021-03-04
Information query
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