Invention Grant
- Patent Title: Modules incorporating encapsulation layers
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Application No.: US16592124Application Date: 2019-10-03
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Publication No.: US11075128B2Publication Date: 2021-07-27
- Inventor: Aarohi Surya Vijh
- Applicant: UTICA LEASECO, LLC
- Applicant Address: US MI Rochester Hills
- Assignee: UTICA LEASECO, LLC
- Current Assignee: UTICA LEASECO, LLC
- Current Assignee Address: US MI Rochester Hills
- Agency: Arent Fox LLP
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L31/048 ; H01L33/52

Abstract:
Aspects of the present disclosure include a packaged product including a product, a first encapsulation disposed on top of the product, wherein the first encapsulation is configured to protect the product during an operation of the product, a second encapsulation disposed on top of the first encapsulation, wherein the second encapsulation is configured to protect the product during a testing of the product, and a third encapsulation disposed on top of the second encapsulation, wherein the third encapsulation is configured to protect the product during a transport of the product, wherein at least one of the first encapsulation, the second encapsulation, or the third encapsulation is detachably coupled with the product.
Public/Granted literature
- US20210104444A1 MODULES INCORPORATING ENCAPSULATION LAYERS Public/Granted day:2021-04-08
Information query
IPC分类: