Invention Grant
- Patent Title: Substrate processing carrier
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Application No.: US16656140Application Date: 2019-10-17
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Publication No.: US11075129B2Publication Date: 2021-07-27
- Inventor: Michael J. Seddon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Adam R. Stephenson, Ltd.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L29/10 ; H01L21/66 ; H01L21/683 ; G01R31/28 ; H01L21/78 ; H01L21/304
Abstract:
Implementations of a substrate carrier may include: a top ring configured to enclose an edge of a first side of a substrate; and a bottom support configured to enclose an entire second side and an edge of the second side of the substrate.
Public/Granted literature
- US20200051877A1 SUBSTRATE PROCESSING CARRIER Public/Granted day:2020-02-13
Information query
IPC分类:
