Invention Grant
- Patent Title: Semiconductor package with EMI shield and fabricating method thereof
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Application No.: US16777519Application Date: 2020-01-30
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Publication No.: US11075170B2Publication Date: 2021-07-27
- Inventor: Doo Soub Shin , Tae Yong Lee , Kyoung Yeon Lee , Sung Gyu Kim
- Applicant: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L21/48 ; H01L23/00 ; H01L23/498 ; H01L21/56 ; H01L23/538 ; H01L25/065
Abstract:
A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.
Public/Granted literature
- US20200243459A1 Semiconductor Package With EMI Shield and Fabricating Method Thereof Public/Granted day:2020-07-30
Information query
IPC分类:
