Invention Grant
- Patent Title: Integrated hybrid standard cell structure with gate-all-around device
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Application No.: US16727731Application Date: 2019-12-26
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Publication No.: US11075195B2Publication Date: 2021-07-27
- Inventor: Chih-Hao Wang , Shang-Wen Chang , Min Cao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/8238 ; H01L27/02 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786 ; G06F30/392

Abstract:
The disclosed circuit includes a first and a second active region (AR) spaced a spacing S along a direction in a first standard cell (SC) that spans Dl along the direction between a first and a second cell edge (CE). Each of the first and second ARs spans a first width W1 along the direction; a third and a fourth AR spaced S in a second SC that spans a second dimension Ds along the direction between a third and a fourth CE; and gate stacks extend from the fourth CE of the second SC to the first CE of the first SC, wherein Ds
Public/Granted literature
- US20210202465A1 Integrated Hybrid Standard Cell Structure with Gate-All-Around Device Public/Granted day:2021-07-01
Information query
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