Invention Grant
- Patent Title: Apparatuses including conductive structures and layouts thereof
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Application No.: US16528077Application Date: 2019-07-31
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Publication No.: US11075205B2Publication Date: 2021-07-27
- Inventor: Masahiko Igeta
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: H01L27/108
- IPC: H01L27/108 ; G11C11/4074

Abstract:
Embodiments of the disclosure are drawn to arrangements of one or more conductive structures to provide connections to circuits or portions thereof located in different regions of a device. One or more of the conductive structures may include extensions and recesses. The extensions and recesses of different conductive structures may be complementary. That is, the extensions of one conductive structure may extend into a recess of another conductive structure.
Public/Granted literature
- US20210035985A1 APPARATUSES INCLUDING CONDUCTIVE STRUCTURES AND LAYOUTS THEREOF Public/Granted day:2021-02-04
Information query
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