Invention Grant
- Patent Title: Insulated gate bipolar transistor, and manufacturing method therefor
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Application No.: US16864263Application Date: 2020-05-01
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Publication No.: US11075292B2Publication Date: 2021-07-27
- Inventor: Tse-Huang Lo
- Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
- Current Assignee Address: CN Jiangsu
- Agency: Polsinelli PC
- Priority: CN201711270146.8 20171205
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L21/265 ; H01L21/027 ; H01L21/28 ; H01L21/306 ; H01L21/3213 ; H01L21/762 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/49 ; H01L29/66

Abstract:
An insulated gate bipolar transistor includes a substrate; a first conductivity type base disposed on the substrate and having a first trench; a first conductivity type buffer region disposed in the first conductivity type base; a collector doped region having a second conductivity type and disposed in the first conductivity type base; a second conductivity type base to which the first trench extends downwardly; a gate oxide layer disposed on an inner surface of the first trench; a polysilicon gate disposed inside the gate oxide layer; an emitter doped region having a first conductivity type and disposed in the second conductivity type base and under the first trench; a conductive plug extending downwardly from above the first trench and contacting the second conductivity type base; and an insulating oxide layer filled in the first trench, the insulating oxide layer insulating and isolating the polysilicon gate from the emitter doped region.
Public/Granted literature
- US20200259006A1 INSULATED GATE BIPOLAR TRANSISTOR, AND MANUFACTURING METHOD THEREFOR Public/Granted day:2020-08-13
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