Invention Grant
- Patent Title: Nanosheet with buried gate contact
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Application No.: US16728462Application Date: 2019-12-27
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Publication No.: US11075301B2Publication Date: 2021-07-27
- Inventor: Jingyun Zhang , Choonghyun Lee , Takashi Ando , Alexander Reznicek , Pouya Hashemi
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/423 ; H01L29/66 ; H01L21/768 ; H01L29/06 ; H01L21/311 ; H01L29/786 ; H01L21/02 ; H01L21/285

Abstract:
A semiconductor structure including a nanosheet stack on a silicon germanium on insulator substrate, the nanosheet stack including alternating layers of a sacrificial semiconductor material and a semiconductor channel material vertically aligned and stacked one on top of another, a gate conductor orthogonal to the nanosheet stack and wrapping around the semiconductor channel material layers of the nanosheet stack, and a gate contact on the gate conductor layer adjacent to the nanosheet stack.
Public/Granted literature
- US20210202749A1 NANOSHEET WITH BURIED GATE CONTACT Public/Granted day:2021-07-01
Information query
IPC分类: