Implementations of semiconductor packages may include: a wafer having a first side and a second side, a solder pad coupled to the first side of the wafer, a through silicon via (TSV) extending from the second side of the wafer to the solder pad a metal layer around the walls of the TSV, and a low melting temperature solder in the TSV. The low melting temperature solder may also be coupled to the metal layer. The low melting temperature solder may couple to the solder pad through an opening in a base layer metal of the solder pad.