- Patent Title: Method for preparing modular planar interconnect plate, modular planar interconnect plate assembly including the interconnect plate, and stamping assembly for preparing the interconnect plate
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Application No.: US16437863Application Date: 2019-06-11
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Publication No.: US11075391B2Publication Date: 2021-07-27
- Inventor: Sea-Fue Wang , Fan-Ping Chen , Hsi-Chuan Lu
- Applicant: National Taipei University of Technology , Ceram Energy Technology Co., Ltd.
- Applicant Address: TW Taipei; TW Taoyuan
- Assignee: National Taipei University of Technology,Ceram Energy Technology Co., Ltd.
- Current Assignee: National Taipei University of Technology,Ceram Energy Technology Co., Ltd.
- Current Assignee Address: TW Taipei; TW Taoyuan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW108104954 20190214
- Main IPC: H01M8/026
- IPC: H01M8/026 ; H01M8/0206 ; H01M8/2483 ; H01M8/12 ; H01M8/2425 ; H01M8/0258 ; H01M8/124
Abstract:
A method for preparing a modular planar interconnect plate for a solid oxide fuel cell includes the steps of: (a) providing a metal blank sheet, (b) stamping a main region of the metal blank sheet to form a plurality of columns of upper protrusions on an upper surface of the main region of the metal blank sheet and a plurality of columns of lower depressions on a lower surface of the main region of the metal blank sheet, and (c) stamping the main region of the metal blank sheet to forma plurality of rows of lower protrusions on a lower surface of the main region of the metal blank sheet and a plurality of rows of upper depressions on the upper surface of the main region of the metal blank sheet.
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