Invention Grant
- Patent Title: Semiconductor relay module and semiconductor relay circuit
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Application No.: US17067765Application Date: 2020-10-12
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Publication No.: US11075631B2Publication Date: 2021-07-27
- Inventor: Toshinobu Akutagawa , Shigenari Okada , Shinya Sasaki
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Shinjyu Global Ip
- Priority: JPJP2019-197681 20191030
- Main IPC: H01H45/14
- IPC: H01H45/14 ; H03K17/687 ; H01H45/00 ; H01H50/02 ; H01H50/00 ; H01H47/00 ; H01F7/06

Abstract:
A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.
Public/Granted literature
- US20210135669A1 SEMICONDUCTOR RELAY MODULE AND SEMICONDUCTOR RELAY CIRCUIT Public/Granted day:2021-05-06
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