Invention Grant
- Patent Title: Speaker assembly
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Application No.: US16524186Application Date: 2019-07-29
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Publication No.: US11076235B2Publication Date: 2021-07-27
- Inventor: Hongjian Hu , Siyuan Ni
- Applicant: AAC Technologies Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AAC Technologies Pte. Ltd.
- Current Assignee: AAC Technologies Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: W&G Law Group LLP
- Priority: CN201821245460.0 20180803
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R9/06 ; H05K1/02 ; H05K1/18 ; H04R1/06 ; H04R7/12 ; H04R9/02 ; H04R7/18

Abstract:
The present disclosure provides a speaker assembly. The speaker assembly includes: a frame, a magnetic circuit system, a vibration system, and a flexible circuit board. The flexible circuit board includes a first mounting portion, a second mounting portion spaced from the first mounting portion for being fixed to the frame, and a pair of elastic arms. Each elastic arm includes a first fixing end connected to the first mounting portion, a first connecting arm extending from the first fixing portion, a second fixing end connected to the second mounting portion, a second connecting arm extending from the second fixing end, and a connecting portion connecting the first connecting arm to the second connecting arm. The two connecting portions of the two elastic arms are connected with each other at the corresponding portions.
Public/Granted literature
- US20200045459A1 Speaker Assembly Public/Granted day:2020-02-06
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