Invention Grant
- Patent Title: Infrastructure equipment providing terrestrial coverage to terrestrial electronic devices and aerial coverage to aerial electronic devices
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Application No.: US16643591Application Date: 2018-07-26
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Publication No.: US11076329B2Publication Date: 2021-07-27
- Inventor: Shinichiro Tsuda , Hideji Wakabayashi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: EP17189880 20170907
- International Application: PCT/EP2018/070357 WO 20180726
- International Announcement: WO2019/048127 WO 20190314
- Main IPC: H04W36/08
- IPC: H04W36/08 ; H04W76/27 ; H04B7/06 ; H04L5/00 ; H04W36/30 ; H04W16/28 ; H04W24/10
Abstract:
Infrastructure equipment comprising circuitry configured to provide a terrestrial cell coverage to a terrestrial UE and an aerial cell coverage to an aerial UE, the aerial cell coverage being provided in a tracking manner in relation to a mobility of the aerial UE.
Public/Granted literature
Information query
