Invention Grant
- Patent Title: Thermally conductive insert element for electronic unit
-
Application No.: US16747097Application Date: 2020-01-20
-
Publication No.: US11076503B2Publication Date: 2021-07-27
- Inventor: Jakub Korta , Marcel Fruend , Klaus Kaufmann
- Applicant: APTIV TECHNOLOGIES LIMITED
- Applicant Address: BB St. Michael
- Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee Address: BB St. Michael
- Agency: Carlson, Gaskey & Olds
- Priority: EP19152913 20190121
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/473 ; H01L23/367 ; H05K5/06 ; H01L23/433

Abstract:
Electronic unit comprises an housing comprising a top cover; a printed circuit board mounted inside the housing and comprising at least a first heating source element on the top layer of the printed circuit board; the top cover comprises at least a first opening; the electronic unit comprises at least a first thermally conductive insert element distinct from the housing and extending from its top extremity arranged around the first opening, to its bottom extremity in thermal contact with the first heating source element such that heating dissipation of the first heating source element is allowed; fixing means configured to entirely fix the top extremity of the first thermally conductive insert element with the top cover around the first opening.
Public/Granted literature
- US20200236811A1 THERMALLY CONDUCTIVE INSERT ELEMENT FOR ELECTRONIC UNIT Public/Granted day:2020-07-23
Information query