Invention Grant
- Patent Title: Ultrasonic endoscope
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Application No.: US16197816Application Date: 2018-11-21
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Publication No.: US11076837B2Publication Date: 2021-08-03
- Inventor: Katsuya Yamamoto , Yasuhiko Morimoto , Satoru Okada
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-130083 20160630
- Main IPC: A61B8/12
- IPC: A61B8/12 ; A61B8/00 ; B06B1/06 ; A61B1/12

Abstract:
An ultrasonic endoscope has an ultrasonic vibrator array in which a plurality of ultrasonic vibrators are arrayed; a backing material layer that supports the ultrasonic vibrators; shield cables that each include a signal wire and a shield member for the signal wire; a flexible printed wiring board that extends on a side opposite to the ultrasonic vibrator array with respect to the backing material layer and that includes a ground portion electrically connected to the shield members; and a heat conductive layer that is provided on at least one surface of the flexible printed wiring board and connected to the ground portion, the heat conductive layer dissipating heat generated in the plurality of ultrasonic vibrators to the ground portion.
Public/Granted literature
- US20190090857A1 ULTRASONIC ENDOSCOPE Public/Granted day:2019-03-28
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