Invention Grant
- Patent Title: Mold assembly and method of molding a component
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Application No.: US16364542Application Date: 2019-03-26
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Publication No.: US11077590B2Publication Date: 2021-08-03
- Inventor: David Bartlett , Elizabeth O'Neill , Robert Moser , Roger Dickerhoof , Carl Miller , Joshua Jeffers , Bryan Woosley , James Merryfield
- Applicant: The United States of America, as represented by the Secretary of the Navy
- Applicant Address: US IN Crane
- Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee: The United States of America, as represented by the Secretary of the Navy
- Current Assignee Address: US IN Crane
- Agency: Naval Surface Warfare Center, Crane Division
- Agent Eric VanWittenburg
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C45/00 ; C08L63/00 ; B29C45/26 ; B29C45/64 ; C08G73/00 ; B29K63/00 ; B29L31/36 ; H01R43/00
Abstract:
A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
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