Invention Grant
- Patent Title: Head module
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Application No.: US16835714Application Date: 2020-03-31
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Publication No.: US11077663B2Publication Date: 2021-08-03
- Inventor: Keita Hirai , Keita Sugiura
- Applicant: Brother Kogyo Kabushiki Kaisha
- Applicant Address: JP Nagoya
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya
- Agency: Banner & Witcoff, Ltd.
- Priority: JPJP2019-069588 20190401,JPJP2019-204417 20191112
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A head module includes first individual channels each including a first nozzle orifice; a first supply manifold being in fluid communication with the first individual channels and configured to allow liquid to flow into the first individual channels therefrom; a first return manifold being in fluid communication with the first individual channels and configured to allow liquid not ejected from the first nozzle orifices to flow thereinto; second individual channels each including a second nozzle orifice; a second supply manifold being in fluid communication with the second individual channels and configured to allow liquid to flow into the second individual channels therefrom; a second return manifold being in fluid communication with the second individual channels and configured to allow liquid not ejected from the second nozzle orifices to flow thereinto; and a first bypass path providing fluid communication between the first supply manifold and the second return manifold.
Public/Granted literature
- US20200307197A1 Head Module Public/Granted day:2020-10-01
Information query
IPC分类: