Binding folder for binding a bundle of leaves, whereby this binding folder comprises a cover with a spine and two endpapers. In the spine a U-shaped profile from heat-conductive material is applied. The U-shaped profile comprises a base and upright arms. In the U-shaped profile a binding adhesive in the form of a hotmelt adhesive is applied. The U-shaped profile in the spine is applied by an assembly adhesive between the upright arms of the U-shaped profile and the spine of the cover. The assembly adhesive extends beyond the free edges of the upright arms and over these free edges.