Invention Grant
- Patent Title: Assembly of subassemblies having a mating bond interface for a motor vehicle
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Application No.: US16808776Application Date: 2020-03-04
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Publication No.: US11077894B2Publication Date: 2021-08-03
- Inventor: Scott Allen Grajek , Jesse Brian Straight , Dustin Martin Fowler , Shane Caird Morse
- Applicant: Global IP Holdings, LLC
- Applicant Address: US MI Sterling Heights
- Assignee: Global IP Holdings, LLC
- Current Assignee: Global IP Holdings, LLC
- Current Assignee Address: US MI Sterling Heights
- Agency: Brooks Kushman P.C.
- Main IPC: B62D35/00
- IPC: B62D35/00 ; B62D29/04 ; B62D37/02

Abstract:
An assembly of subassemblies having a mating bond interface for a motor vehicle is provided. The assembly includes a first subassembly of molded composite material and a second subassembly of molded composite material. An adjustable mating interface couples the subassemblies together. The interface includes a groove and a flange disposed on the first subassembly and bonded within the groove. The groove is sized and shaped relative to the size and shape of the flange to allow a bonding position of the flange within the groove to be adjusted during assembly of the subassemblies so that the mating interface is adjustable.
Information query
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