Invention Grant
- Patent Title: Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
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Application No.: US16332259Application Date: 2017-10-10
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Publication No.: US11078361B2Publication Date: 2021-08-03
- Inventor: Tatsuya Arisawa , Hirohisa Goto , Tomoyuki Abe
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2016-203510 20161017,JPJP2017-002290 20170111
- International Application: PCT/JP2017/036606 WO 20171010
- International Announcement: WO2018/074278 WO 20180426
- Main IPC: C08L71/12
- IPC: C08L71/12 ; C08L63/04 ; C08G65/332 ; C08J5/24 ; C08G59/06 ; C08G59/40 ; H05K1/03 ; B32B15/08 ; C08F290/06 ; C08G59/68 ; B32B27/00 ; C08J5/10 ; C08L101/00 ; C08K5/3492 ; C08L63/00 ; C08K5/49 ; C08K5/5313 ; C08K5/00 ; C08K5/5399
Abstract:
One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.
Public/Granted literature
Information query
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