- Patent Title: Radiative cooling substrate and manufacturing method of the same
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Application No.: US16282747Application Date: 2019-02-22
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Publication No.: US11078593B2Publication Date: 2021-08-03
- Inventor: Yu-Bin Chen , Hung-Sheng Han
- Applicant: NATIONAL TSING HUA UNIVERSITY
- Applicant Address: TW Hsinchu
- Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW107138663 20181031
- Main IPC: C25D13/06
- IPC: C25D13/06 ; C25D13/12 ; C25D13/20 ; F28F13/18 ; C25D13/22
Abstract:
A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 μm to 10 μm. The chitosan layer emits radiation within a waveband between 8 μm and 13 μm.
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