Invention Grant
- Patent Title: Radiation-based thickness gauge
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Application No.: US16775737Application Date: 2020-01-29
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Publication No.: US11079222B2Publication Date: 2021-08-03
- Inventor: Vahe Ghazikhanian , Ahmad R. Shishegar
- Applicant: NDC Technologies Inc.
- Applicant Address: US OH Dayton
- Assignee: NDC Technologies Inc.
- Current Assignee: NDC Technologies Inc.
- Current Assignee Address: US OH Dayton
- Agency: Morrison & Foerster LLP
- Main IPC: G01B15/02
- IPC: G01B15/02 ; G01N23/087 ; G01N23/20066 ; G01N23/203

Abstract:
Described are system and method embodiments for measuring a thickness of a material layer using electromagnetic radiation. In some embodiments, a system includes a radiation source configured to direct first radiation towards a first surface of a layer of material having a thickness between the first surface and a second surface opposite the first surface. The first radiation causes the material layer to emit secondary radiation. A filter is positioned between the material layer and a radiation detector and in the beam path of the second radiation in order to attenuate a portion of the second radiation associated with fluorescence of the material to emit third radiation. Then, the radiation detector is configured to detect the third radiation and a controller is configured to provide a measurement corresponding to the thickness of the material layer based on the detected third radiation.
Public/Granted literature
- US20200240776A1 RADIATION-BASED THICKNESS GAUGE Public/Granted day:2020-07-30
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