Invention Grant
- Patent Title: Wiegand module and methods of forming the same
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Application No.: US15953977Application Date: 2018-04-16
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Publication No.: US11079253B2Publication Date: 2021-08-03
- Inventor: Choon Aun Chong , Weng Fei Wong , Yik Foong Soo
- Applicant: Avago Technologies International Sales PTE, Limited
- Applicant Address: SG Singapore
- Assignee: Avago Technologies International Sales PTE, Limited
- Current Assignee: Avago Technologies International Sales PTE, Limited
- Current Assignee Address: SG Singapore
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: G01D5/14
- IPC: G01D5/14 ; H01F27/28 ; H01F27/40 ; H05K1/18 ; H01F27/24 ; H05K1/11

Abstract:
A package comprises a body having a mounting surface so as to be mounted to an external surface, and a coil having at least 100 turns around a coil axis. A first end of the coil is oriented in a first direction substantially parallel to the mounting surface such that the first end is attachable to the external surface. The package includes a ferromagnetic element that extends along the coil axis such that the ferromagnetic element is magnetically coupled to the coil. The body is configured to house the coil and the ferromagnetic element.
Public/Granted literature
- US20190316934A1 WIEGAND MODULE AND METHODS OF FORMING THE SAME Public/Granted day:2019-10-17
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