A test jig for testing electrical characteristics of a semiconductor product includes a conductive ground block for supporting the semiconductor product thereon; a substrate provided on the ground block, and having a first and a second substrate electrodes formed on the substrate for the respective electrodes to be in contact with leads of the semiconductor; and lead pressers for pressing the leads against the first and the second substrate electrodes, respectively, so that electrical connection is established between the respective leads and the first and the second substrate electrodes in testing the semiconductor product.