Invention Grant
- Patent Title: Memory sub-system including an in package sequencer separate from a controller
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Application No.: US16123907Application Date: 2018-09-06
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Publication No.: US11080210B2Publication Date: 2021-08-03
- Inventor: Samir Mittal , Ying Yu Tai , Cheng Yuan Wu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F13/16 ; G06F13/42 ; G06F11/07
Abstract:
An instruction can be received at a sequencer from a controller. The sequencer can be in a package including the sequencer and one or more memory components. The sequencer is operatively coupled to a controller that is separate from the package. A processing device of the sequencer can perform an operation based on the instruction on at least one of the one or more memory components in the package.
Public/Granted literature
- US20200081851A1 MEMORY SUB-SYSTEM INCLUDING AN IN PACKAGE SEQUENCER SEPARATE FROM A CONTROLLER Public/Granted day:2020-03-12
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