One chip-shaped electronic component 100 of the present invention has a substrate 10, and a termination electrode layer 80 formed on an end face of the substrate 10. The termination electrode layer 80 is made of a mixed material that contains an electrically-conductive substance (a′) (containing carbon (a) as one type of the electrically-conductive substance (a′)), whisker-like particles (b) covered with the electrically-conductive substance (a′), flake-like particles (c) having electroconductivity, and a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800. In addition, a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1.