Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16560151Application Date: 2019-09-04
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Publication No.: US11081321B2Publication Date: 2021-08-03
- Inventor: Syuji Nozawa , Yoji Iizuka , Tatsuya Yamaguchi
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2018-166546 20180906
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
There is provided a substrate processing apparatus including: a chamber in which a target substrate is accommodated; a first gas supply part configured to supply a gas containing a first monomer, and a gas containing a second monomer, which forms a polymer through a polymerization reaction with the first monomer, into the chamber so as to form a film of the polymer on the target substrate; an exhaust device configured to exhaust a gas inside the chamber; a first exhaust pipe configured to connect the chamber and the exhaust device; and an energy supply device configured to supply an energy with respect to a gas flowing through the first exhaust pipe so as to cause an unreacted component of at least one of the first monomer and the second monomer contained in the gas exhausted from the chamber to be reduced in a molecular weight.
Public/Granted literature
- US20200083029A1 Substrate Processing Apparatus Public/Granted day:2020-03-12
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